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Highly anisotropic etch process
Deep reactive-ion etching (DRIE) is a special subclass of reactive-ion etching (RIE). It enables highly anisotropic etch process used to create deep penetration
Deep_reactive-ion_etching
Method used to relatively precisely remove material in a controlled and fine fashion
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet
Reactive-ion_etching
Very small devices that incorporate moving components
Reactive-ion etching (RIE) operates under conditions intermediate between sputter and plasma etching (between 10−3 and 10−1 Torr). Deep reactive-ion etching
MEMS
Technique in microfabrication used to remove material and create structures
Such anisotropy is maximized in deep reactive ion etching (DRIE). The use of the term anisotropy for plasma etching should not be conflated with the
Etching_(microfabrication)
Semiconductor material, a surface modification of silicon
side effect of reactive ion etching (RIE). Other methods for forming a similar structure include electrochemical etching, stain etching, metal-assisted
Black_silicon
In geometry, property of being directionally dependent
material is perpendicular to the layers. Anisotropic etching techniques (such as deep reactive-ion etching) are used in microfabrication processes to create
Anisotropy
include the LIGA fabrication process, advanced silicon etch, and deep reactive ion etching. LIGA Micromechanical systems — high aspect ratio (HAR) micromachining
HARMST
German manufacturer of semiconductor products
inch wafers and has advanced technical capabilities including deep reactive ion etching (DRIE) and plasma enhanced fusion bonding.[clarification needed]
Elmos_Semiconductor
Manufacturing process used to create integrated circuits
conductivity) Etching (microfabrication) Dry etching (plasma etching) Reactive-ion etching (RIE) Deep reactive-ion etching (DRIE) Atomic layer etching (ALE) Plasma
Semiconductor device fabrication
Semiconductor_device_fabrication
Alcatel Micro Machining Systems (AMMS) was a French manufacturer of Deep Reactive Ion Etching systems. The company's headquarters were located in Annecy, France
Alcatel Micro Machining Systems
Alcatel_Micro_Machining_Systems
Controlled material removal, without the use of liquid substances
of dry etching is reactive-ion etching. Unlike with many (but not all, see isotropic etching) of the wet chemical etchants used in wet etching, the dry
Dry_etching
electrothermal actuators include deep X-ray lithography, LIGA (lithography, electroplating, and molding), and deep reactive ion etching (DRIE). These techniques
MEMS_electrothermal_actuator
Industrial process
for anisotropic deep-etching of diamond nanostructures by application of high bias in inductively coupled plasma/reactive ion etching (ICP/RIE) reactor
Plasma_etching
Technology in semiconductor device fabrication
Advanced Silicon Etching (ASE) is a deep reactive-ion etching (DRIE) technique to etch deep and high aspect ratio structures in silicon. ASE was created
Advanced_silicon_etching
Chemical compound and greenhouse gas
processes such as deep reactive-ion etching. A small fraction of the SF 6 breaks down in the plasma into sulfur and fluorine, with the fluorine ions performing
Sulfur_hexafluoride
with embedded thin-film thermoelectric material deep reactive-ion etching (DRIE) – process that creates deep, steep-sided holes and trenches in a wafer or
Glossary of microelectronics manufacturing terms
Glossary_of_microelectronics_manufacturing_terms
Topics referred to by the same term
Bosch process may refer to: Bosch deep reactive-ion etching, a microfabrication technique to form high aspect ratio features. Haber–Bosch process, ammonia
Bosch_process
Fabrication at micrometre scales and smaller
removed. Etching techniques include: Dry etching (plasma etching) such as reactive-ion etching (RIE) or deep reactive-ion etching (DRIE) Wet etching or chemical
Microfabrication
Artificial dry adhesives
include photolithography/electron beam lithography, plasma etching, deep reactive ion etching (DRIE), chemical vapor deposition (CVD), and micro-molding
Synthetic_setae
Topics referred to by the same term
Establishment (RARDE) in 1962 The Aspect Ratio Dependent Etching effect found in Deep reactive-ion etching. This disambiguation page lists articles associated
ARDE
Topics referred to by the same term
spontaneous emission or superluminescence Advanced silicon etching, a deep reactive ion etching Adaptive Server Enterprise, a database product from Sybase
ASE
Wafer bonding technique
UV light exposure is applied but can also be achieved through deep reactive-ion etching (DRIE). During coating and structuring of the SU-8 the tempering
Adhesive bonding of semiconductor wafers
Adhesive_bonding_of_semiconductor_wafers
Emission of surface atoms through energetic particle bombardment
ion milling or ion etching. Sputtering can also play a role in reactive-ion etching (RIE), a plasma process carried out with chemically active ions and
Sputtering
Japan, and its product line can be divided into three categories: Plasma etching systems (RIE, ICP, DRIE) Plasma deposition systems (PECVD and LS-CVD®)
SAMCO
Award: Dr. Franz Laermer and Andrea Urban for the invention of the deep reactive ion etching process (Bosch Process), a key process for manufacturing semiconductor
Eduard_Rhein_Foundation
Ocular route of drug administration
such as stainless steel or titanium. Laser micro-drilling or deep reactive ion etching (DRIE) are the manufacturing tools used to fabricate the hollow
Suprachoroidal_drug_delivery
Swiss and German engineer
"Precision micro-mechanical components in single crystal diamond by deep reactive ion etching". Microsystems & Nanoengineering. 4 (1): 12. Bibcode:2018MicNa
Niels_Quack
Process used to produce micromachinery or microelectromechanical systems
substrate. This type of etching is inexpensive and is generally used in early, low-budget research. Deep reactive-ion etching "Microengineering -- Bulk
Bulk_micromachining
Cutoff frequency Cyclotron radiation Debye length Debye sheath Deep reactive-ion etching Degenerate matter Degree of ionization DEMO, DEMOnstration Power
List of plasma physics articles
List_of_plasma_physics_articles
American semiconductor equipment company
company uses reactive ion etch (RIE) and atomic layer etching (ALE) to shape a variety of conductive and dielectric features. The company's deep RIE technologies
Lam_Research
remaining resistance after etching, channels are given hydrophilic treatment using oxygen plasma or deep reactive-ion etching(DRIE). V-groove, unlike U-groove
Open_microfluidics
Light-sensitive material used in making electronics
dose and focus latitudes required for curing, and resistance to reactive ion etching. Other key properties are sensitivity, compatibility with tetramethylammonium
Photoresist
Microtechnology
Conventional micromachining techniques such as wet etching, dry etching, deep reactive ion etching, sputtering, anodic bonding, and fusion bonding have
Bio-MEMS
composed of silicon and created via the Bosch process, an example of Deep reactive ion etching and not to be confused with the Haber–Bosch process. In the Bosch
Microstructured optical arrays
Microstructured_optical_arrays
techniques and photolithography and deep reactive ion etching (DRIE) of silicon wafers to create nanochannels with backside etching of a reservoir for loading
Tissue_nanotransfection
Integrated circuit
deposition (oxide + protective nitride) Lithography print Dry etch (Reactive-ion etching) Trench fill with oxide Chemical-mechanical polishing of the oxide
Shallow_trench_isolation
Chemical compound
breakage.[clarification needed] Titanium carbide can be etched with reactive-ion etching. Titanium carbide is used in preparation of cermets, which are frequently
Titanium_carbide
Movement of ions in an electrical field
Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons
Electromigration
Oxidizing acid mixture containing sulfuric acid and hydrogen peroxide
material residue from silicon wafers. It is also widely employed in wet etching of wafers in the semiconductor fabrication process. In the laboratory,
Piranha_solution
Superconducting circuit element
or focused ion beam etches the pattern on the device. Dry or wet etching can be used. Dry etching processes use physical etchants or reactive gases, while
Josephson_junction
Research in lithium-ion batteries has produced many proposed refinements of lithium-ion batteries. Areas of research interest have focused on improving
Research in lithium-ion batteries
Research_in_lithium-ion_batteries
Chemical element with atomic number 55 (Cs)
January 2010. Marcucci, M. G.; Polk, J. E. (2000). "NSTAR Xenon Ion Thruster on Deep Space 1: Ground and flight tests (invited)". Review of Scientific
Caesium
Use of nanotechnology to improve lithium-ion batteries
plasma etching on silicon. Another approached used highly anisotropic etching of a silicon substrate through electrochemical or reactive ion etching to create
Nanoarchitectures for lithium-ion batteries
Nanoarchitectures_for_lithium-ion_batteries
Solution of hydrogen fluoride in water
March 2024. the HF molecule can cause deep tissue damage, including destruction of the bone. …when fluoride ions bind to calcium and magnesium Bajraktarova-Valjakova
Hydrofluoric_acid
Spectroscopic technique
composition across the surface, or for depth profiling when paired with ion-beam etching. It is often applied to study chemical processes in the materials in
X-ray photoelectron spectroscopy
X-ray_photoelectron_spectroscopy
Method of fabricating nanometer scale patterns using a special stamp
pattern resist is left on the substrate. A pattern transfer process (reactive ion etching, normally) can be used to transfer the pattern in the resist to the
Nanoimprint_lithography
Highly corrosive mineral acid
dissolved atmospheric nitrogen gas. He used a high voltage battery and non-reactive electrodes and vessels such as gold electrode cones that doubled as vessels
Nitric_acid
Indian engineer
surface preparation and fluorination via inductively coupled plasma-reactive ion etching". Carbon. 228 119366. Bibcode:2024Carbo.22819366G. doi:10.1016/j
Pulickel_Ajayan
Carbon allotrope
monolayer-deep, nanometre-wide trenches into h-BN, and subsequently fill them with graphene using chemical vapour deposition. Modifying the etching parameters
Graphene_nanoribbon
Chemical element with atomic number 54 (Xe)
later employed as a propellant for JPL's Deep Space 1 probe, Europe's SMART-1 spacecraft and for the three ion propulsion engines on NASA's Dawn Spacecraft
Xenon
Diode that emits light from an organic compound
those based on small molecules and those employing polymers. Adding mobile ions to an OLED creates a light-emitting electrochemical cell (LEC) which has
OLED
Chemical element with atomic number 14 (Si)
Gondek, Christoph; Kroke, Edwin; Roewer, Gerhard (2019). "Wafer Cleaning, Etching, and Texturization". Handbook of Photovoltaic Silicon. pp. 311–358. doi:10
Silicon
Transparent non-crystalline solid material
Middle East, and India. The Romans perfected cameo glass, produced by etching and carving through fused layers of different colours to produce a design
Glass
American chemistry award
activation by metal ions. More recently, his interests have evolved toward understanding the reaction pathways and relative reactivities of organometallic
Willard_Gibbs_Award
Class of materials
monolayers, and are patterned in a series of etching steps involving chlorine and oxygen reactive ion etching, and a hydrofluoric acid wash. These properties
Self-cleaning_surfaces
Type of sedimentary rock
The makeup of a carbonate rock outcrop can be estimated in the field by etching the surface with dilute hydrochloric acid. This etches away the calcite
Limestone
Pillar-shaped nanostructure
of nanosphere lithography (a way of organizing the lattice) and reactive ion etching(molding the nanopillars to the right shape) to make large groups
Nanopillar
Electronic oscillator circuit
tubular channels are created along linear defects. For processing involving etching, e.g. the wristwatch tuning fork crystals, low etch channel density is
Crystal_oscillator
Electronic component that exploits the electronic properties of semiconductor materials
with steps such as thermal oxidation, thin-film deposition, ion implantation, and etching, during which electronic circuits are gradually created on a
Semiconductor_device
Electromagnetic radiation with wavelengths from 1 m to 1 mm
techniques use microwaves to generate plasma for such purposes as reactive ion etching and plasma-enhanced chemical vapor deposition (PECVD). Microwaves
Microwave
Hexagonal lattice made of carbon atoms
methods. Graphene can be created by opening carbon nanotubes by cutting or etching. In one such method, multi-walled carbon nanotubes were cut open in solution
Graphene
Steel alloy resistant to corrosion
deformed, broken, and removed from parts of the component, exposing the bare reactive metal. When the two surfaces are of the same material, these exposed surfaces
Stainless_steel
Extremely small diamonds used for their thermal, mechanical and optoelectronic properties
for BDD surface modifications including anodization, hydrogen plasma, etching into porous forms, carbon-based nanomaterials, polymer films and nanoparticles
Nanodiamond
Chemical modification
this surface patterning method has since been extended to proteins. Caged etching agents (such as hydrogen fluoride protected with 4-hydroxyphenacyl) allows
Photolabile_protecting_group
White powder insoluble in water
has been variously described as the generation of reactive oxygen species, the release of Zn2+ ions, and a general disturbance of the bacterial cell membrane
Zinc_oxide
Biometric identifier
Kupfertafeln nebst dazu gehörigen Erklärungen [Anatomical Illustrations (etchings) with Accompanying Explanations, volume 4]. Berlin, Prussia: Georg Jacob
Fingerprint
Nano-scale semiconductor particles
QDs release free cadmium ions causing cell death. Group II–VI QDs also have been reported to induce the formation of reactive oxygen species after exposure
Quantum_dot
Biological tissues incorporating minerals
repeatedly deposits a thin silicon film. The interfaces are etched by reactive ion etching and then filled with photoresist. There are three films deposited
Mineralized_tissues
Organic molecules
top-down method of miniaturizing devices using sophisticated lithography and etching techniques has reached a physical limit. Moreover, the top-down approach
Self-assembling_peptide
Indian inventions
etched design in white. They were made according to a technique of alkaline-etching developed by the Harappans during the 3rd millennium BCE and were widely
List of Indian inventions and discoveries
List_of_Indian_inventions_and_discoveries
Vapour phase thin film deposition technique
hydroxyls serve as reactive linkers for condensation reactions with metals. The inorganic precursor reacts with surface reactive groups via the corresponding
Molecular_layer_deposition
Type of second-generation solar cell
thus reducing reflectance. For example, black silicon texturing by reactive ion etching (RIE) is an effective and economic approach to increase the absorption
Thin-film_solar_cell
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